docs(stm32mp1): update doc for FIP/FCONF
Describe the boot using FIP, and how to compile it. The STM32IMAGE boot chain is still available but it is not recommended. Update the build command lines, for FIP. The memory mapping is also updated. Change-Id: I2b1e0df5500b6213d33dc558b0e0da38340a4d79 Signed-off-by: Yann Gautier <yann.gautier@foss.st.com>
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Yann Gautier
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4584e01dc6
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07f81627ab
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@ -37,6 +37,17 @@ The TF-A image must be properly formatted with a STM32 header structure
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for ROM code is able to load this image.
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Tool stm32image can be used to prepend this header to the generated TF-A binary.
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Boot with FIP
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~~~~~~~~~~~~~
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The use of FIP is now the recommended way to boot STM32MP1 platform.
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Only BL2 (with STM32 header) is loaded by ROM code. The other binaries are
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inside the FIP binary: BL32 (SP_min or OP-TEE), U-Boot and their respective
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device tree blobs.
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STM32IMAGE bootchain
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~~~~~~~~~~~~~~~~~~~~
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Although still supported, this way of booting is not recommended.
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Pease use FIP instead.
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At compilation step, BL2, BL32 and DTB file are linked together in a single
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binary. The stm32image tool is also generated and the header is added to TF-A
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binary. This binary file with header is named tf-a-stm32mp157c-ev1.stm32.
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@ -55,15 +66,17 @@ Memory mapping
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| ... |
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0x2FFC0000 +-----------------+ \
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| ... | |
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0x2FFD8000 +-----------------+ |
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| TF-A DTB | | Embedded SRAM
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0x2FFDC000 +-----------------+ |
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| BL2 | |
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0x2FFEF000 +-----------------+ |
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| BL32 DTB | |
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0x2FFC5000 +-----------------+ |
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| BL32 | |
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0x2FFDF000 +-----------------+ |
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| ... | |
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0x2FFE3000 +-----------------+ |
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| BL2 DTB | | Embedded SRAM
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0x2FFEA000 +-----------------+ |
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| BL2 | |
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0x2FFFF000 +-----------------+ |
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| SCMI mailbox | |
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0x30000000 +-----------------+ /
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| ... |
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@ -102,23 +115,110 @@ Available storage medias are:
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- ``STM32MP_SPI_NAND``
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- ``STM32MP_SPI_NOR``
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To build with SP_min and support for all bootable devices:
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Boot with FIP
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~~~~~~~~~~~~~
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You need to build BL2, BL32 (SP_min or OP-TEE) and BL33 (U-Boot) before building FIP binary.
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U-Boot
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______
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.. code:: bash
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make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 AARCH32_SP=sp_min STM32MP_SDMMC=1 STM32MP_EMMC=1 STM32MP_RAW_NAND=1 STM32MP_SPI_NAND=1
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STM32MP_SPI_NOR=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb
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cd <u-boot_directory>
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make stm32mp15_trusted_defconfig
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make DEVICE_TREE=stm32mp157c-ev1 all
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To build TF-A with OP-TEE support for all bootable devices:
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OP-TEE (optional)
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_________________
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.. code:: bash
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make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 AARCH32_SP=optee STM32MP_SDMMC=1 STM32MP_EMMC=1 STM32MP_RAW_NAND=1 STM32MP_SPI_NAND=1 STM32MP_SPI_NOR=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb
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cd <optee_directory>
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make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
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make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 \
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CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
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TF-A BL32 (SP_min)
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__________________
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If you choose not to use OP-TEE, you can use TF-A SP_min.
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To build TF-A BL32, and its device tree file:
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.. code:: bash
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make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
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AARCH32_SP=sp_min DTB_FILE_NAME=stm32mp157c-ev1.dtb bl32 dtbs
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TF-A BL2
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________
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To build TF-A BL2 with its STM32 header for SD-card boot:
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.. code:: bash
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make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
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DTB_FILE_NAME=stm32mp157c-ev1.dtb STM32MP_SDMMC=1
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For other boot devices, you have to replace STM32MP_SDMMC in the previous command
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with the desired device flag.
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This BL2 is independent of the BL32 used (SP_min or OP-TEE)
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FIP
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___
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With BL32 SP_min:
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.. code:: bash
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make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
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AARCH32_SP=sp_min \
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DTB_FILE_NAME=stm32mp157c-ev1.dtb \
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BL33=<u-boot_directory>/u-boot-nodtb.bin \
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BL33_CFG=<u-boot_directory>/u-boot.dtb \
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fip
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With OP-TEE:
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.. code:: bash
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make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
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DTB_FILE_NAME=stm32mp157c-ev1.dtb \
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BL33=<u-boot_directory>/u-boot-nodtb.bin \
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BL33_CFG=<u-boot_directory>/u-boot.dtb \
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BL32=<optee_directory>/tee-header_v2.bin \
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BL32_EXTRA1=<optee_directory>/tee-pager_v2.bin
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BL32_EXTRA2=<optee_directory>/tee-pageable_v2.bin
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fip
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STM32IMAGE bootchain
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~~~~~~~~~~~~~~~~~~~~
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You need to add the following flag to the make command:
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``STM32MP_USE_STM32IMAGE=1``
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To build with SP_min and support for SD-card boot:
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.. code:: bash
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make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
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AARCH32_SP=sp_min STM32MP_SDMMC=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb \
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STM32MP_USE_STM32IMAGE=1
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cd <u-boot_directory>
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make stm32mp15_trusted_defconfig
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make DEVICE_TREE=stm32mp157c-ev1 all
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To build TF-A with OP-TEE support for SD-card boot:
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.. code:: bash
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make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
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AARCH32_SP=optee STM32MP_SDMMC=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb \
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STM32MP_USE_STM32IMAGE=1
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cd <optee_directory>
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make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 \
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CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
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cd <u-boot_directory>
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make stm32mp15_trusted_defconfig
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make DEVICE_TREE=stm32mp157c-ev1 all
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@ -132,7 +232,19 @@ The following build options are supported:
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Populate SD-card
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----------------
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The SD-card has to be formated with GPT.
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Boot with FIP
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~~~~~~~~~~~~~
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The SD-card has to be formatted with GPT.
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It should contain at least those partitions:
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- fsbl: to copy the tf-a-stm32mp157c-ev1.stm32 binary (BL2)
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- fip: which contains the FIP binary
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Usually, two copies of fsbl are used (fsbl1 and fsbl2) instead of one partition fsbl.
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STM32IMAGE bootchain
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~~~~~~~~~~~~~~~~~~~~
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The SD-card has to be formatted with GPT.
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It should contain at least those partitions:
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- fsbl: to copy the tf-a-stm32mp157c-ev1.stm32 binary
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